View UPC3211GR_144686.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

DATA SHEET
BIPOLAR ANALOG INTEGRATED CIRCUIT
PC3211GR
AGC AMPLIFIER FOR DIGITAL CATV RETURN PASS
DESCRIPTION
The PC3211GR is a silicon monolithic integrated circuit designed as AGC amplifier for digital CATV systems. This IC is the AGC amplifier with 55 dB gain control range which is packaged in 20-pin SSOP. The device is able to use for digital QPSK system, therefore it contributes to make design of transmission system simplicity.
FEATURES
* Wide gain control range * Low distortion * Supply Voltage 55 dB TYP. IM3 = 57 dBc TYP. @Pout = -10 dBm IM2 = 44 dBc TYP. @Pout = -10 dBm 9V * Packaged in 20-pin SSOP suitable for high-density surface mount.
ORDERING INFORMATION
Part Number Package 20-pin plastic SSOP (225 mil) Supplying Form Embossed tape 12 mm wide. Pin 1 indicates pull-out direction of tape. Qty 2.5 kp/reel
PC3211GR-E1
To order evaluation samples, please contact your local NEC office. (Part number for sample order: PC3211GR)
Caution electro-static sensitive device
The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version.
Not all devices/types available in every country. Please check with local NEC representative for availability and additional information.
Document No. P13564EJ3V0DS00 (3rd edition) Date Published October 1999 N CP(K) Printed in Japan
The mark
shows major revised points.
(c)
1998, 1999
PC3211GR
INTERNAL BLOCK DIAGRAM AND PIN CONFIGURATION (TOP VIEW)
BY2 VAGC GND2A GND2B VCC1 VCC2 GND2C GND2D GND2E BY3
1 2 3 4 5 6 7 8 9 10 Cont.
20 19 18 17 16 15 14 13 12 11
BY1 AGC IN1 GND1A AGC IN2 GND1B PSAVE PA_BIAS GND3 OUT1 OUT2
REG
TYPICAL APPLICATION
LPF RF IN 50-750 MHz RF Return 5-42 MHz HPF
PC2799GR
1st IF SAW
PC1686GV
2nd IF SAW
PC2798GR
DC-10 MHz A/D Video Amplifier
QAM Demo. &FEC
DUAL PLL
PC3211GR
Bias Digital QPSK Modulator
LPF
2
Data Sheet P13564EJ3V0DS00
PC3211GR
PIN FUNCTIONS
Pin No. 1 2 3 4 5 6 7 8 9 10 11 Pin Name BY2 VAGC GND2A GND2B Vcc1 Vcc2 GND2C GND2D GND2E BY3 OUT2 Pin Voltage TYP. (V) - 0 to 3 0.0 0.0 9.0 9.0 0.0 0.0 0.0 1.64 6.9 Bypass pin of regulator block. Signal output pins. This pins feature low-impedance because of its emitter-follower output port. The pin that is not used should be grounded through 50 ohm resistor.
6
Function and Explanation Non Connection pin. This pin should be opened. Automatic gain control pin. Ground pins of differential amplifier.
Equivalent Circuit
Power supply pin of AGC amplifier block. Power supply pin of differential amplifier and output block. Ground pins of differential amplifier.
11 REG
12
12
OUT1
6.9
13 14
GND3 PA_BIAS
0.0 2.45
Ground pin of output block. This is the pin to feed base bias in case of connection to transistor as power amplifier.
5 VCC (9 V)
15 5 k 14
15
Psave
9.0 (+5 k)
Power-save pin. Vcc : ON GND : SLEEP The 5 k resistor should be connected between 15 pin and Vcc. Ground pin of AGC amplifier block.
16 18 17
GND1B GND1A AGC IN2
0.0 0.0 2.43
Signal input pin. In the case of single input, 17 or 19 pin should be grounded through capacitor.
19
5
19
AGC IN1
2.43
17
20
BY1
-
Non Connection pin. This pin should be opened.
Data Sheet P13564EJ3V0DS00
3
PC3211GR
ABSOLUTE MAXIMUM RATINGS (TA = +25C unless otherwise specified)
Parameter Supply Voltage Power-save Voltage AGC Voltage Power Dissipation Operating Ambient Temperature Storage Temperature Maximum Input Level Symbol VCC V (Psave) VAGC PD TA Tstg Pin (MAX) TA = +75C Note 2 Note 1 Test Condition Rating 11.0 11.0 3.6 500 -40 to +75 -55 to +150 +5 Unit V V V mW C C dBm
Notes 1. Bias to 15 pin through 5 k resistor. 2. Mounted on 50 mm x 50 mm x 1.6 mm double epoxy glass board. RECOMMENDED OPERATING RANGE
Parameter Supply Voltage Power-save Voltage AGC Control Voltage Operating Ambient Temperature Input Frequency Maximum Input Level Symbol VCC V (Psave) VAGC TA fin Pin (MAX) Note Test Condition MIN. 8.0 0 0 -40 5 - TYP. 9.0 - - +25 - - MAX. 10.0 10.0 3.3 +75 100 0 Unit V V V C MHz dBm
Note Bias to 15 pin through 5 k resistor. ELECTRICAL CHARACTERISTICS (TA = +25C, VCC = 9 V, VAGC = 0 V, V (Psave) = 9 V (+5 k), unless otherwise specified)
Parameter Circuit Current 1 Maximum Gain Gain Control Range Symbol ICC1 GMAX GCR Test Conditions No input signal Note 1 MIN. 29 14 47 TYP. 38 16 55 MAX. 51 18 - Unit mA dB dB
fin = 65 MHz, Pin = -20 dBm Note 2 fin = 65 MHz, Pin = -20 dBm, VAGC = 0 to 3 V Note 2 fin = 65 MHz, Pin = -20 dBm, V (Psave) = 0 V (+5 k) Note 2 fin1 = 65 MHz, fin2 = 66.8 MHz, Pout = -10 dBm Note 2 fin1 = 65 MHz, fin2 = 66.8 MHz, Pout = -10 dBm Note 2
Isolation at sleep mode
Isol
60
65
-
dB
2nd order intermodulation distortion
IM2
-
-44
-40
dBc
3rd order intermodulation distortion
IM3
-
-57
-50
dBc
Notes 1. By measurement circuit 1 2. By measurement circuit 2
4
Data Sheet P13564EJ3V0DS00
PC3211GR
STANDARD CHARACTERISTICS (TA = +25C, VCC = 9 V, VAGC = 0 V, V (Psave) = 9 V (+5 k), unless otherwise specified)
Parameter Maximum Output Power Circuit Current at Power-save mode Symbol PO (sat) ICC (P/S) Test Conditions fin = 65 MHz, Pin = -5 dBm Note 1 Reference Value +5 3 Unit dBm mA
No input signal, V (Psave) = 0 V (+5 k) Note 2 fin = 65 MHz Note 3
Noise Figure Output Intercept Point Gain Flatness
NF OIP3 Gflat
10 +16 0.1
dB dBm dB
fin1 = 65 MHz, fin2 = 66.8 MHz Note 1 fin = 5 to 100 MHz, 6 MHz Band width Pin = -20 dBm Note 1 No input signal, VAGC = 3 V fin = 65 MHz, V (Psave) = 0 9 V (+5 k) fin = 65 MHz, V (Psave) = 9 0 V (+5 k) Note 2
Circuit Current 2 ON Time
ICC2 tON
43 200
mA
sec
msec
Note 4 1.7 Note 4
OFF Time
tOFF
Notes 1. By measurement circuit 2 2. By measurement circuit 1 3. By measurement circuit 3 4. By measurement circuit 4
Data Sheet P13564EJ3V0DS00
5
PC3211GR
TYPICAL CHARACTERISTICS (TA = +25C)
50
CIRCUIT CURRENT vs. SUPPLY VOLTAGE
40 35
CIRCUIT CURRENT vs. POWER-SAVE VOLTAGE
40
Circuit Current ICC (mA)
Circuit Current ICC (mA)
30 25 20 15 10 5 0 no input signal VCC = 9 V measurement circuit1 0 2 4 6 8 10 12 Power-save Voltage V(Psave) (V)
30
20
10 no input signal measurement circuit1 2 4 6 8 10 12
0 0
Supply Voltage VCC (V) Power-save Voltage V(Psave) (V)
45 44 43 42 41 40 39 38 37 36 35 0
CIRCUIT CURRENT vs. AGC VOLTAGE
3
14PIN VOLTAGE vs. SUPPLY VOLTAGE
2.5
14 pin Voltage V(14) (V)
Circuit Current ICC (mA)
2
1.5
1 no input signal VAGC = 0 V measurement circuit1 2 4 6 8 10 12
no input signal VCC = 9 V V(Psave) = 9V measurement circuit1 0.5 1 1.5 2 2.5 3 3.5
0.5
0 0
AGC Voltage VAGC (V)
Supply Voltage VCC (V) Power-save Voltage V(Psave) (V)
20
GAIN vs. INPUT FREQUENCY
-20
GAIN vs. INPUT FREQUENCY
Pin = -20 dBm VAGC = 3 V measurement circuit2
18
-30
Gain (dB)
Gain (dB)
16
-40
14 VCC = V(Psave) = 8 to 10 V 12 Pin = -20 dBm VAGC = 0 V measurement circuit2 10 0 20 -50 Vcc = V(Psave) = 8 V Vcc = V(Psave) = 9 V Vcc = V(Psave) = 10 V 0 20 40 60 80 100 Input Frequency fin (MHz)
40
60
80
100
-60
Input Frequency fin (MHz)
6
Data Sheet P13564EJ3V0DS00
PC3211GR
20 10 0
Gain (dB)
GAIN vs. AGC VOLTAGE
fin = 65 MHz Pin = -20 dBm measurement circuit2
Output Power Pout (dBm)
OUTPUT POWER vs. INPUT POWER
10 fin = 65 MHz VAGC = 0 V 5 measurement circuit2 0 -5
-10 -20 -30 -40 -50 VCC = V(Psave) = 8 V VCC = V(Psave) = 9 V VCC = V(Psave) = 10 V 0 0.5 1 1.5 2 2.5 3 3.5 AGC Voltage VAGC (V)
-10 -15 -20 -30
-25
-20
VCC = V(Psave) = 8 V VCC = V(Psave) = 9 V VCC = V(Psave) = 10 V -10 -5 0 -15
Input Power Pin (dBm)
OUTPUT POWER vs. INPUT POWER
20 12
NOISE FIGURE vs. INPUT FREQUENCY
VAGC = 0 V measurement circuit3
0
Output Power Pout (dBm)
VAGC = 0 V VAGC = 1.1 V VAGC = 1.5 V
Noise Figure NF (dB)
11
-20
10
-40 VAGC = 2.2 V -60 VAGC = 3 V -80 -30 VCC = 9 V V(Psave) = 9 V fin = 65 MHz measurement circuit2 -10 -5 0
9 VCC = V(Psave) = 8 V VCC = V(Psave) = 9 V VCC = V(Psave) = 10 V 60 80 100
-25
-20
-15
8 0 20 40
Input Power Pin (dBm)
Input Frequency fin (MHz)
30 20 10 0 -10
Gain (dB)
GAIN vs. INPUT FREQUENCY
VAGC = 0 V VAGC = 1.1 V VAGC = 1.5 V VAGC = 2.2 V VAGC = 3 V VAGC = 3.3 V VCC = 9 V V(Psave) = 9 V Pin = -20 dBm measurement circuit2 0 20 40 60 80 100 Input Frequency fin (MHz)
-20 -30 -40 -50 -60 -70 -80
Data Sheet P13564EJ3V0DS00
7
PC3211GR
STANDARD CHARACTERISTICS (TA = +25C)
3rd ORDER INTERMODULATION DISTORTION
20 10 20 10
2nd ORDER INTERMODULATION DISTORTION
Output Power Pout / tone (dBm)
0 -10 -20 -30 -40 -50 -60 -70 -80 -40 VCC = V(Psave) = 9 V fin1 = 65 MHz fin2 = 66.8 MHz VAGC = 0 V Pout = -13 dBm/tone = -10 dBm(total) measurement circuit2 -30 -20 -10 Input Power Pin (dBm)
Output Power Pout / tone (dBm)
0 -10 -20 -30 -40 -50 -60 -70 -80 -40 VCC = V(Psave) = 9 V fin1 = 65 MHz fin2 = 66.8 MHz VAGC = 0 V Pout = -13 dBm/tone = -10 dBm(total) measurement circuit2 -30 -20 Input Power Pin (dBm) -10
-50 -60 -70 -20
2nd Order Intermodulation Distortion IM2 (dBc)
-10
IM3 vs. OUTPUT POWER
3rd Order Intermodulation Distortion IM3 (dBc)
VCC = V(Psave) = 9 V fin1 = 65 MHz -20 fin2 = 66.8 MHz VAGC = 0 V Pout = -13 dBm/tone = -10 dBm(total) -30 measurement circuit2 -40
VCC = V(Psave) = 9 V fin1 = 65 MHz -10 fin2 = 66.8 MHz VAGC = 0 V Pout = -13 dBm/tone = -10 dBm(total) -20 measurement circuit2 -30 -40 -50 -60 -20
0
IM2 vs. OUTPUT POWER
-15
-10
-5
0
-15
-10
-5
0
Output Power Pout/tone (dBm)
Output Power Pout/tone (dBm)
ON/OFF TIME OF POWERSAVE
REF 0.0 dBm 10 dB/ ATT 10 dB VCC = 9 V fin= 65 MHz Pin = -20 dBm Input Voltage = 9 V measurement circuit4
RBW 3 MHz VBW 3 MHz SWP 7.5 ms CENTER 65.000000 MHz SPAN 0 Hz
8
Data Sheet P13564EJ3V0DS00
PC3211GR
THERMAL CHARACTERISTICS (FOR REFERENCE)
CIRCUIT CURRENT vs. AMBIENT TEMPERATURE
VAGC = 3 V 40 18 VAGC = 0 V
50
20
GAIN vs. INPUT FREQUENCY
TA = -40 C TA = +25 C TA = +75 C
Circuit Current ICC (mA)
Gain (dB)
no input signal VCC = 9 V V(Psave) = 9 V measurement circuit1 -25 0 25 50 75 100
30
16
20
14 VCC = 9 V V(Psave) = 9 V 12 Pin = -20 dBm VAGC = 0 V measurement circuit2 10 0 20
10
0 -50
40
60
80
100
Ambient Temperature TA (C)
Input Frequency fin (MHz)
20 10 0
GAIN vs. AGC VOLTAGE
VCC = 9 V V(Psave) = 9 V fin = 65 MHz Pin = -20 dBm measurement circuit2
Gain (dB)
-10 -20 -30 -40 -50 0 TA = -40 C TA = +25 C TA = +75 C 0.5 1 1.5
2
2.5
3
3.5
AGC Voltage VAGC (V)
Data Sheet P13564EJ3V0DS00
9
PC3211GR
STANDARD CHARACTERISTICS INPUT IMPEDANCE (19 PIN)
S11
hp
1 U FS
1: 5 MHz 533.6 -16.4 2: 40 MHz 515.2 -81.4 3: 65 MHz 493.7
3
-123.3 4: 100 MHz 455.9 -190.3 TA = +25C VCC = 9 V V (Psave) = 9 V
START
.100 000 MHz
STOP
100.000 000 MHz
Pin = -20 dBm
OUTPUT IMPEDANCE (11 PIN)
S22
hp
1 U FS
1: 5 MHz 9.779 -2.306 2: 40 MHz 10.066
3 4 2 1
3.033 3: 65 MHz 10.574 5.237 4: 100 MHz 11.88 7.805 TA = +25C VCC = 9 V V (Psave) = 9 V Pin = -20 dBm
START
5.000 000 MHz
STOP
100.000 000 MHz
10
Data Sheet P13564EJ3V0DS00
PC3211GR
MEASUREMENT CIRCUIT 1
1 VAGC 100 pF 3 4 VCC 0.01 F 5 6 7 8 9 10 0.1 F 18 17 0.1 F 16 15 14 10 k 13 12 11 0.1 F AGC OUT AGC OUT Note 5 k 0.01 F V(Psave) 100 pF 0.01 F 2 Cont. 20 0.1 F 19 AGC IN
100 pF
REG
0.1 F
Note The pin that is not connected to Spectrum Analyzer should be grounded through 50 resistor. MEASUREMENT CIRCUIT 2
Note 1 SG1 (50 ) SG2 (50 )
1 VAGC 100 pF 3 4 VCC 0.01 F 5 6 7 8 9 10 0.1 F 0.01 F 2 Cont.
20 0.1 F 19 18 17 0.1 F 16
MIXPAD
5 k 0.01 F 100 pF REG 15 100 pF 14 10 k 13 12 11 0.1 F Note 2 V(Psave)
0.1 F
Spectrum Analyzer (50 )
Notes 1. Connect in the case of measurement of IM2/IM3 2. The pin that is not connected to Spectrum Analyzer should be grounded through 50 resistor.
Data Sheet P13564EJ3V0DS00
11
PC3211GR
MEASUREMENT CIRCUIT 3
1 VAGC 100 pF 3 4 VCC 0.01 F 5 6 7 8 9 10 0.1 F 0.01 F 2 Cont.
20 0.1 F 19 18 17 16 5 k 0.01 F 15 100 pF 14 10 k 13 12 11 0.1 F Note V(Psave) NF METER Noise Source
0.1 F
100 pF
REG
0.1 F
Note The pin that is not connected to Spectrum Analyzer should be grounded through 50 resistor. MEASUREMENT CIRCUIT 4
1 VAGC 100 pF 3 4 VCC 0.01 F 5 6 7 8 9 10 0.1 F 0.01 F 2 Cont.
20 0.1 F 19 18 17 16 5 k 0.01 F 15 100 pF 14 10 k 13 12 11 0.1 F Spectrum Analyzer (50 ) 50 Pulse Generator (9 V, 2.3 msec) SG1 (50 )
0.1 F
100 pF
REG
0.1 F
12
Data Sheet P13564EJ3V0DS00
PC3211GR
ILLUSTRATION OF THE EVALUATION BOARD FOR MEASUREMENT CIRCUIT
V(Psave)
AGC IN1
OUT 1
100 p 0.1 0.1 5k
0.01
0.1
10 k 0.1
OUT 2
100 p 0.01
100 p 0.1 0.01
PC3211GR
VAGC
VCC
Notes 1. 50 x 50 x 1.6 mm double sided copper clad polyimide board. 2. Back side: GND pattern 3. Solder plated on pattern 4. : Through holes
Data Sheet P13564EJ3V0DS00
13
PC3211GR
PACKAGE DIMENSIONS
20 PIN PLASTIC SSOP (225 mil) (UNIT: mm)
20 11
detail of lead end
3-3
+7
1 6.7 0.3
10
1.8 MAX. 1.5 0.1
6.4 0.2 4.4 0.1 1.0 0.2
0.5 0.2 0.65 0.22 -0.05 0.1 0.1
+0.10
0.15 0.10 M
0.15 0.575 MAX.
+0.10 -0.05
NOTE
Each lead centerline is located within 0.10 mm of its true position (T.P.) at maximum material condition.
14
Data Sheet P13564EJ3V0DS00
PC3211GR
RECOMMENDED SOLDERING CONDITIONS
This product should be soldered under the following recommended conditions. For soldering methods and conditions other than those recommended below, contact your NEC sales representative.
Recommended Condition Symbol IR35-00-3
Soldering Method Infrared Reflow
Soldering Conditions Package peak temperature: 235C or below Time: 30 seconds or less (at 210C) Note Count: 3, Exposure limit : None Package peak temperature: 215C or below Time: 40 seconds or less (at 200C) Note Count: 3, Exposure limit : None Pin temperature: 300C Time: 3 seconds or less (per side of device) Note Exposure limit : None
VPS
VP15-00-3
Partial Heating
-
Note After opening the dry pack, keep it in a place below 25C and 65% RH for the allowable storage period. Caution Do not use different soldering methods together (except for partial heating).
For details of the recommended soldering conditions for surface mounting, refer to information document SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL (C10535E).
Data Sheet P13564EJ3V0DS00
15
PC3211GR
* The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version. * No part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in this document. * NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from use of a device described herein or any other liability arising from use of such device. No license, either express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC Corporation or others. * Descriptions of circuits, software, and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. The incorporation of these circuits, software, and information in the design of the customer's equipment shall be done under the full responsibility of the customer. NEC Corporation assumes no responsibility for any losses incurred by the customer or third parties arising from the use of these circuits, software, and information. * While NEC Corporation has been making continuous effort to enhance the reliability of its semiconductor devices, the possibility of defects cannot be eliminated entirely. To minimize risks of damage or injury to persons or property arising from a defect in an NEC semiconductor device, customers must incorporate sufficient safety measures in its design, such as redundancy, fire-containment, and anti-failure features. * NEC devices are classified into the following three quality grades: "Standard", "Special", and "Specific". The Specific quality grade applies only to devices developed based on a customer designated "quality assurance program" for a specific application. The recommended applications of a device depend on its quality grade, as indicated below. Customers must check the quality grade of each device before using it in a particular application. Standard: Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots Special: Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support) Specific: Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems or medical equipment for life support, etc. The quality grade of NEC devices is "Standard" unless otherwise specified in NEC's Data Sheets or Data Books. If customers intend to use NEC devices for applications other than those specified for Standard quality grade, they should contact an NEC sales representative in advance.
M7 98. 8

▲Up To Search▲

Price & Availability of UPC3211GR

	To Download UPC3211GR Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .